In situ stress evolution during sputter deposition of Cu/Co bilayers and multilayers

Journal of Applied Physics

Volumn 101, Issue 7, 2007, Pages

  Pletea, M ^a   Bruckner W ^a   Wendrock, H ^a   Thomas, J ^a   Kaltofen, R ^a   Koch, R ^b  

^a IFW DRESDEN   (Germany)

^b PAUL DRUDE INSTITUT FÜR FESTKÖRPERELEKTRONIK   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COBALT; COPPER; INTERFACIAL ENERGY; LATTICE MISMATCH; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON; SPUTTER DEPOSITION; STRESS ANALYSIS; TRANSMISSION ELECTRON MICROSCOPY;

BILAYERS; STRESS EVOLUTION;

MULTILAYERS;

EID: 34247257886     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2719688     Document Type: Article

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