The future of microelectromechanical systems (MEMS)

Strain

Volumn 45, Issue 3, 2009, Pages 208-220

  Marinis, T F ^a  

^a CHARLES STARK DRAPER LABORATORY   (United States)

Author keywords

Industry growth; MEMS; Product offerings; System integration

Indexed keywords

APPROPRIATE TECHNOLOGIES; ASIC CHIPS; CMOS WAFERS; EMBEDDED INDUCTORS; GUIDANCE SYSTEM; IC CHIPS; INDUSTRY GROWTH; INKJET PRINTS; IS DEVELOPMENT; MEMSDEVICES; MICROELECTROMECHANICAL SYSTEMS; MICROMACHINED; MULTIPLE DEVICES; NEW PRODUCT; OPTICAL SWITCHING; PRODUCT OFFERINGS; RF COMMUNICATION; SELF-ASSEMBLY TECHNIQUE; SINGLE CHIPS; SYSTEM INTEGRATION; SYSTEM-ON-CHIP PRODUCTS; TISSUE SAMPLES; WAFER STACKING;

APPLICATION SPECIFIC INTEGRATED CIRCUITS; AUTOMOBILE ELECTRONIC EQUIPMENT; COMPOSITE MICROMECHANICS; ELECTRONIC GUIDANCE SYSTEMS; INTEGRATION; MICROELECTROMECHANICAL DEVICES; MICROPROCESSOR CHIPS; MILITARY APPLICATIONS; OPTICAL COMMUNICATION; POLYSILICON; PRESSURE SENSORS; PRESSURE TRANSDUCERS; REMOTE SENSING;

MEMS;

EID: 65649088233     PISSN: 00392103     EISSN: 14751305     Source Type: Journal    
DOI: 10.1111/j.1475-1305.2008.00463.x     Document Type: Article

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