Three-dimensional interconnect technology on a flexible polyimide film

Journal of Micromechanics and Microengineering

Volumn 14, Issue 1, 2004, Pages 38-48

  Han, Ji Song ^a   Tan, Zhi Yong ^a   Sato, K ^a   Shikida, M ^a  

^a NAGOYA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL RESISTANCE; ELECTROLESS PLATING; ETCHING; EVAPORATION; MICROELECTROMECHANICAL DEVICES; SEMICONDUCTOR DEVICE MANUFACTURE; SPECIFIC HEAT OF SOLIDS; TEMPERATURE; THERMODYNAMIC PROPERTIES; THICKNESS MEASUREMENT; THIN FILM DEVICES; THREE DIMENSIONAL;

FLEXIBLE POLYIMIDE FILM; THERMAL ISOLATION; THERMAL RESPONSE; THREE DIMENSIONAL INTERCONNECT; WET ETCHING METHOD;

POLYIMIDES;

EID: 0942268412     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/14/1/306     Document Type: Article

References (11)

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