Mems modular packaging and interfaces

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 681-688

  Schuenemann, Matthias ^a   Jam, Kourosh Amiri ^b   Grosser, Volker ^b   Leutenbauer, Rudolf ^b   Bauer, Gerd ^a   Schaefer, Wolfgang ^a   Reichl, Herbert ^b  

^a FRAUNHOFER INSTITUTE FOR MANUFACTURING ENGINEERING AND AUTOMATION IPA   (Germany)

^b Institute for Reliability and Microintegration Berlin   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE INDUSTRY; COST EFFECTIVENESS; ELECTRONICS PACKAGING; PRODUCT DESIGN; RELIABILITY;

MICROELECTROMECHANICAL SYSTEM MODULAR PACKAGING; TOP BOTTOM BALL GRID ARRAY;

MICROELECTROMECHANICAL DEVICES;

EID: 0034476173     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)