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Materials Transactions

Volumn 50, Issue 2, 2009, Pages 266-274

Influence of Ag on kinetics of solid-state reactive diffusion between Pd and Sn

(2) Sakama, Taro a Kajihara, Masanori a

a TOKYO INSTITUTE OF TECHNOLOGY (Japan)

Author keywords

Conductor; Diffusion bonding; Intermetallic compounds; Reactive diffusion; Solder; Volume diffusion

Indexed keywords

ANNEALING; BRAZING; DIFFUSION; DIFFUSION BONDING; GRAIN SIZE AND SHAPE; PALLADIUM; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; TIN;

CONDUCTOR; INTERMETALLIC COMPOUNDS; REACTIVE DIFFUSION; SOLDER; VOLUME DIFFUSION;

GRAIN GROWTH;

EID: 63149118598 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.MRA2008292 Document Type: Article

Times cited : (9)

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