Investigation of interfacial reactions between Sn-Zn solder with electrolytic Ni and electroless Ni(P) metallization

Journal of Alloys and Compounds

Volumn 440, Issue 1-2, 2007, Pages 117-121

  Sharif, Ahmed ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Intermetallics; Mechanical properties; Microstructure; Sn Zn solder alloy; Surfaces and interfaces

Indexed keywords

ELECTROLYTIC ANALYSIS; INTERFACES (MATERIALS); METALLIZING; MICROSTRUCTURE; NICKEL; SURFACE CHEMISTRY; TIN ALLOYS; ZINC ALLOYS;

FRACTURE SURFACES; LIQUID STATE ANNEALING; SN-ZN SOLDER ALLOY;

SOLDERING ALLOYS;

EID: 34249705765     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.09.020     Document Type: Article

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