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Materials Transactions

Volumn 47, Issue 3, 2006, Pages 822-828

Fast penetration of Sn into Ag by diffusion induced recrystallization

(2) Takenaka, Toshio a Kajihara, Masanori a

a TOKYO INSTITUTE OF TECHNOLOGY (Japan)

Author keywords

Conductor; Grain boundary diffusion; Interface reaction; Intermetallic compounds; Solder

Indexed keywords

CRYSTALLIZATION; DIFFUSION; ELECTRIC CONDUCTIVITY; INTERMETALLICS; TIN; TIN ALLOYS;

CONDUCTORS; GRAIN BOUNDARY DIFFUSION; INTERFACE REACTIONS; SOLDERS;

SILVER;

EID: 33646766145 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.47.822 Document Type: Article

Times cited : (29)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.