Influence of Si on reactive diffusion between Au and Sn at solid-state temperatures

Materials Science and Engineering: A

Volumn 445-446, Issue , 2007, Pages 604-610

  Furuto, A ^a   Kajihara, M ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Bulk diffusion; Diffusion bonding; Intermetallic compounds; Reactive diffusion; Solder

Indexed keywords

ADDITION REACTIONS; ANNEALING; DIFFUSION; GOLD ALLOYS; GRAIN BOUNDARIES; GRAIN GROWTH; INTERMETALLICS; SILICON; SOLDERING ALLOYS; TIN ALLOYS;

BULK DIFFUSION; DIFFUSION BONDING; REACTIVE DIFFUSION; SOLID-STATE TEMPERATURES;

REACTION KINETICS;

ADDITION REACTIONS; ANNEALING; DIFFUSION; GOLD ALLOYS; GRAIN BOUNDARIES; GRAIN GROWTH; INTERMETALLICS; REACTION KINETICS; SILICON; SOLDERING ALLOYS; TIN ALLOYS;

EID: 33845872293     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.09.102     Document Type: Article

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