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Volumn 16, Issue 5, 2001, Pages 1249-1251
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Effects of Cu and Ni additions to eutectic Pb-Sn solders on Au embrittlement of solder interconnections
a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
AGING OF MATERIALS;
COPPER;
EMBRITTLEMENT;
EUTECTICS;
GOLD;
INTERMETALLICS;
LEAD ALLOYS;
NICKEL;
SOLDERING;
SOLDER INTERCONNECTIONS;
SOLDERING ALLOYS;
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EID: 0035352105
PISSN: 08842914
EISSN: None
Source Type: Journal
DOI: 10.1557/JMR.2001.0175 Document Type: Article |
Times cited : (22)
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References (10)
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