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Volumn 16, Issue 5, 2001, Pages 1249-1251

Effects of Cu and Ni additions to eutectic Pb-Sn solders on Au embrittlement of solder interconnections

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; COPPER; EMBRITTLEMENT; EUTECTICS; GOLD; INTERMETALLICS; LEAD ALLOYS; NICKEL; SOLDERING;

EID: 0035352105     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2001.0175     Document Type: Article
Times cited : (22)

References (10)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.