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Metallurgical Transactions A

Volumn 23, Issue 4, 1992, Pages 1323-1332

The growth of Cu-Sn intermetallics at a pretinned copper-solder interface

(3) Sunwoo, A J a Morris, J W b Lucey, G K c

a LAWRENCE LIVERMORE NATIONAL LABORATORY (United States)

b UNIVERSITY OF CALIFORNIA (United States)

c U S ARMY RESEARCH LABORATORY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 51649143798 PISSN: 03602133 EISSN: 15431940 Source Type: Journal
DOI: 10.1007/BF02665064 Document Type: Article

Times cited : (169)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.