Temperature Aging of External Connections Condensation Soldered to Ti-Pd-Au Thin Films

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 2, Issue 2, 1979, Pages 180-195

  Keller, Harry N ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTORS - JOINTS; INTEGRATED CIRCUIT TESTING; INTEGRATED CIRCUITS, HYBRID; SOLDERS - AGING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0018483059     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCHMT.1979.1135443     Document Type: Article

References (27)

1. F. G. Foster, “Embrittlement of solder by gold from plated surfaces,” A.S.T.M. Special Tech. Pub., no. 319, pp. 13-19, 1962.
2. W. G. Bader, “Dissolution of Au, Ag, Pd, Pt, Cu and Ni in a molten tin-lead solder,” Welding Research Supplement, pp. 551-7, Dec. 1969.
3. J. Whitfield and A. J. Cubbin, “Experiemental observations on the effect of gold and palladium on soldered joints,” A. T.E. Journal, vol. 24, no. 1, 1965.
4. R. N. Wild, “Some fatigue properties of solders and solder joints,” in Proc. Nat. Electron. Packaging and Production Conf., pp. 105-116, 1974.
5. T. Y. Chu, J. C. MoUendorf, and R. C. Pfahl, Jr., “A new mass soldering process: Condensation soldering,” in Proc. Nat. Electron. Packaging and Production Conf., pp. 101-104, 1974.
6. H. H. Manko, Solders and Soldering. New York :McGraw-Hill, 1964, pp. 6-7.
7. L. W. Condra, “Vapor condensation soldering of external leads to thin film hybrid integrated circuits,” in Proc. 27th Electron. Components Conf., pp. 135-140, 1977.
8. R. H. Minetti and L. J. Rickabaugh, “Solder dissolution rates of evaporated and sputtered Ti-Pd-Au and NiCr-Au thin films,” in Proc. 27th Electron. Components Conf., pp. 212-219, 1977.
9. L. J. Rickabaugh, “The effect of thin film deposition angle and substrate surface roughness on film dissolution in molten 60% Sn-40% Pb solder,” Electrocomp. Sci. Tech., vol. 4, no. 1, pp. 43-46, 1977.
10. L. J. Rickabaugh, unpublished memorandum.
11. F. N. Fuss and C. T. Hartwig, “Corrosion of solder-coated TiPdAu thin film conductors in a moist chlorine atmosphere,” in Proc. 27th Electron. Components Conf, pp. 72-83, 1977.
12. L. W. Condra and E. H. Mayer, unpublished memorandum.
13. R. A. Bulwith, “Failure analysis of solder joints,” Insulation Circuits, vol. 24, no. 2, pp. 19-23, 1978.
14. P. M. Hall, “Least squares activation energy”, Texas Instruments Professional Program Exchange PPX-52, Sept. 24, 1976.
15. M. L. Ackroyd and C. A. MacKay, “Solders, solderable finishes and reflowed solder coatings,” Circuit World, vol. 3, no. 2, pp. 6-12, 1977.
16. P. M. Hall, J. M. Morabito, and J. M. Poate, “Diffusion mechanisms in the Pd/Au thin film system and the correlation of resistivity change with auger electron spectroscopy and Rutherford backscattering profiles,” Thin Solid Films, vol. 33, pp. 107-134, 1976.
17. G. M. Green, “The soft soldering of gold plated surfaces, A review,” Rep. No. MEC/R446/1974/806, Standard Telecommunication Laboratories LTD, Mar. 19, 1974.
18. D. Olsen, R. Wright, and H. Berg, “Effects of intermetallics on the reliability of tin coated Cu, Ag, and Ni parts,” in Proc. 13th Ann. Reliability Physics Symp., pp. 80-86, 1975.
19. P. L. Blum, J. Pelissier, and G. Silvestre, “An investigation of soldered copper-tin bond brittleness by electron microscopy,” Solid State Technol, vol. 16, pp. 55-58, 1973.
20. P. J. Kay and C. A. MacKay, “The growth of intermetallic compounds on common basis materials coated with tin and tin-lead alloys,” Trans. Inst. Metal Finishing, vol. 54, pp. 68-74, 1976.
21. K. N. Tu, “Interdiffusion and reaction in bimetallic Cu-Sn thin films,” Acta Metallurgica, vol. 21, pp. 347-354, 1973.
22. L. Zakraysek, “Intermetallic characterization,” Proc. 11th Ann. Reliability Physics Conf, pp. 6-9, 1973.
23. J. E. Bennett and T. M. Paskowski, unpublished memorandum.
24. V. A. Johnson and A. Pinella, unpublished report.
25. L. W. Condra and P. M. Hall, unpublished memorandum.
26. B. T. Lampe, “Room temperature aging properties of some solder alloys,” Welding J., vol. 55, no. 10, pp. 300S-340S, 1976.
27. H. N. Keller, unpublished work in progress.