A novel packaging methodology for spray cooling of power semiconductor devices using dielectric liquids

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 3, Issue , 2005, Pages 2014-2018

  Vanam, K ^a   Junghans, J ^a   Barlow, F ^a   Selvam, R P ^a   Balda, J C ^a   Elshabini, A ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; DIELECTRIC LIQUIDS; HEAT FLUX; POWER ELECTRONICS; RELIABILITY; SPRAYING; THERMAL LOAD;

PACKAGING METHODOLOGY; POWER ELECTRONICS SYSTEMS; SPRAY COOLING; SPRAYING PARAMETERS;

SEMICONDUCTOR DEVICES;

EID: 33745002526     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APEC.2005.1453335     Document Type: Conference Paper

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