System-in-package technology: Opportunities and challenges

Proceedings of the 9th International Symposium on Quality Electronic Design, ISQED 2008

Volumn , Issue , 2008, Pages 589-593

  Fontanelli, Anna ^a  

^a MENTOR GRAPHICS CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EDA SOLUTIONS; ELECTRONIC DESIGNS; IC PACKAGING; INTERNATIONAL SYMPOSIUM; MOORE'S LAWS; RELIABILITY IMPROVEMENT; SEMICONDUCTOR INDUSTRIES; SYSTEM-IN-PACKAGE; SYSTEM-IN-PACKAGE TECHNOLOGY; SYSTEM-ON-CHIP; WIRELESS PHONES;

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CELLULAR RADIO SYSTEMS; CHIP SCALE PACKAGES; COST REDUCTION; COSTS; ELECTRIC CONDUCTIVITY; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS ENGINEERING; FINANCE; INDUSTRIAL ECONOMICS; INTEGRATED CIRCUITS; INTERNET PROTOCOLS; PROGRAMMABLE LOGIC CONTROLLERS; SEMICONDUCTING INDIUM; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR MATERIALS; SOLUTIONS; SYSTEMS ANALYSIS; TELECOMMUNICATION; TELECOMMUNICATION EQUIPMENT; TELEPHONE SETS;

TRANSISTORS;

EID: 49749117871     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISQED.2008.4479803     Document Type: Conference Paper

References (14)

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12. Joe Adam, Vice President SkyWorks, "System-in-Package Roadmap", First International Workshop on SoP, SiP, SoC Electronics Technologies 2005.
13. Rao Tummala, "System-on-Package (SOP)", First International Workshop on SoP, SiP, SoC Electronics Technologies 2005.
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