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Volumn , Issue , 2008, Pages

Simulation of migration effects in PoP

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CURRENT DENSITY; ELECTRONICS INDUSTRY; EXPERIMENTS; FINITE ELEMENT METHOD; MICROELECTRONICS; POLLUTION; SOLDERING; STRESSES; SULFATE MINERALS; WELDING;

EID: 49349105284     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2008.4525074     Document Type: Conference Paper
Times cited : (16)

References (8)
  • 2
    • 33947223147 scopus 로고    scopus 로고
    • Optimization of Thermomechanical Reliability of Board-level Package-on-Package Stacking Assembly
    • Y.-S. Lai;, T.H. Wang; C.-C. Wang: "Optimization of Thermomechanical Reliability of Board-level Package-on-Package Stacking Assembly" IEEE Trans. Comp. Pack. Tech., (2006), pp.1-5.
    • (2006) IEEE Trans. Comp. Pack. Tech , pp. 1-5
    • Lai, Y.-S.1    Wang, T.H.2    Wang, C.-C.3
  • 4
    • 49349102123 scopus 로고    scopus 로고
    • http://www.practicalcomponents.com/amkor/amkor-pop.htm
  • 5
    • 0142186254 scopus 로고    scopus 로고
    • Static and dynamic analysis of failure locations and void formation in interconnects due to various migration mechanism
    • K. Weide-Zaage, D. Dalleau, X. Yu; "Static and dynamic analysis of failure locations and void formation in interconnects due to various migration mechanism", Mat. Sci. Semi. Proc., 6 (2003), 85-92.
    • (2003) Mat. Sci. Semi. Proc , vol.6 , pp. 85-92
    • Weide-Zaage, K.1    Dalleau, D.2    Yu, X.3
  • 6
    • 0032404852 scopus 로고    scopus 로고
    • Influence of the Material Properties on the thermal behaviour of a Package
    • K. Weide, C. Keck, X. Yu: "Influence of the Material Properties on the thermal behaviour of a Package", SPIE, Proc Conf. Micro. Manu. Yield & Rel.; (1998), pp. 112-121.
    • (1998) SPIE, Proc Conf. Micro. Manu. Yield & Rel , pp. 112-121
    • Weide, K.1    Keck, C.2    Yu, X.3
  • 7
    • 34047157123 scopus 로고    scopus 로고
    • Investigation of diffusion and electromigration parameters for Cu-Sn intermetallic compounds in Pb-free solders using simulated annealing
    • Chao, B.; Chae, S.-H.; et.al.: "Investigation of diffusion and electromigration parameters for Cu-Sn intermetallic compounds in Pb-free solders using simulated annealing", Acta Met., 55, 2007, pp.2805-2814.
    • (2007) Acta Met , vol.55 , pp. 2805-2814
    • Chao, B.1    Chae, S.-H.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.