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Volumn , Issue , 2008, Pages
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Simulation of migration effects in PoP
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Author keywords
[No Author keywords available]
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Indexed keywords
BRAZING;
CURRENT DENSITY;
ELECTRONICS INDUSTRY;
EXPERIMENTS;
FINITE ELEMENT METHOD;
MICROELECTRONICS;
POLLUTION;
SOLDERING;
STRESSES;
SULFATE MINERALS;
WELDING;
3-DIMENSIONAL PACKAGING;
AMBIENT TEMPERATURES;
APPLICATIONS.;
CHARACTERISATION;
CONDUCTIVE LINES;
FINITE ELEMENT SIMULATIONS;
FINITE ELEMENTS;
HIGHER INTEGRATION;
INTERNATIONAL CONFERENCES;
MICRO-SYSTEMS;
MIGRATION EFFECTS;
MINIATURISATION;
MULTI-PHYSICS SIMULATION;
REFERENCE TEMPERATURE;
SOLDER BUMPING;
SOLDER JOINTS;
STRESS FREE;
VIA FILL;
WARPAGE;
LEAD;
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EID: 49349105284
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ESIME.2008.4525074 Document Type: Conference Paper |
Times cited : (16)
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References (8)
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