Double-sided liquid cooling for power semiconductor devices using embedded power packaging

Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)

Volumn 2, Issue , 2005, Pages 1138-1143

  Charboneau, B C ^a   Wang, F ^c   Van Wyk, J D ^c   Boroyevich, D ^c   Liang, Z ^c   Scott, E P ^c   Tipton, C W ^b  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^b U S ARMY RESEARCH LABORATORY   (United States)

^c NONE

Author keywords

Double sided cooling; Forced liquid convection; Power density; Semiconductor packaging

Indexed keywords

DOUBLE-SIDED COOLING; FORCED LIQUID CONVECTION; POWER DENSITY; SEMICONDUCTOR PACKAGING;

COOLING; EMBEDDED SYSTEMS; FORCED CONVECTION; HEAT RESISTANCE; MOSFET DEVICES;

SEMICONDUCTOR DEVICES;

EID: 33745900560     PISSN: 01972618     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IAS.2005.1518500     Document Type: Conference Paper

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