Methodology for avoidance of ratcheting-induced stable cracking (RISC) in microelectronic devices

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1429-1435

  Zhang, Zhen ^a   Suo, Zhigang ^a   Liu, Yong ^b   Irving, Scott ^b   Luk, Timwah ^b   Desbiens, Don ^b  

^a HARVARD UNIVERSITY   (United States)

^b FAIRCHILD SEMICONDUCTOR   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC FILMS; MICROELECTRONIC DEVICES; RATCHETING-INDUCED STABLE CRACKING (RISC);

CERAMIC MATERIALS; PASSIVATION; PLASTIC DEFORMATION; SEMICONDUCTING SILICON; THERMAL EXPANSION; THIN FILMS;

MICROELECTRONICS;

EID: 33845595925     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645844     Document Type: Conference Paper

References (11)

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