Moisture diffusion study in electronic packaging using molecular dynamic simulation

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1425-1428

  Fan, H B ^a   Chan, Edward K L ^a   Wong, Cell K Y ^a   Yuen, Matthew M F ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COMPUTER SIMULATION; DIFFUSION; INTERFACES (MATERIALS); MOISTURE; MOLECULAR DYNAMICS;

EPOXY MOLDING COMPOUND (EMC); INTERFACIAL ADHESION; MOISTURE DIFFUSION; MOLECULAR DYNAMIC SIMULATION;

ELECTRONICS PACKAGING;

EID: 33845563901     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645843     Document Type: Conference Paper

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