The effect of temperature and humidity exposure on adhesion

American Society of Mechanical Engineers, Applied Mechanics Division, AMD

Volumn 222, Issue , 1997, Pages 1-6

  Pearson, R A ^a   Hydro, R M ^a   Lloyd, T B ^b   Nied, H F ^a  

^a Lehigh University   (United States)

^b LEHIGH UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVES; ATMOSPHERIC HUMIDITY; BOND STRENGTH (MATERIALS); EPOXY RESINS; INTERFACES (MATERIALS); SUBSTRATES; TEMPERATURE;

INTERFACIAL FRACTURE ENERGY; MIXED MODE BENDING; ORGANIC ADHESIVE;

FRACTURE MECHANICS;

EID: 0031376712     PISSN: 01608835     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)

1. Ashcroft, I., 1995, "Fracture Toughness of Adhesively Bonded Sheet Steel," Proceedings of the 8th Annual Meeting, Hilton Head, SC, pp. 141-142.
2. Azimi, H. R., Lloyd, T. B., and Pearson, R. A., "Fundamentals of Adhesion: The Utility of the Three-Liquid Probe Method," ASME Intl. Mech. Eng. Congress and Exposition, Nov. 1995, EEP-Vol. 11, pp. 155-161.
3. Brandenburger, P. D. and Pearson, R. A., "Mixed Mode Fracture of Organic Chip Attachment Adhesives," ASME Intl. Mech. Eng. Congress and Exposition:November 1995, EEP-Vol. 11, pp. 179-185.
4. Chan, I. C., Gillham, J. K., Kinloch, A. J. , and Shaw, S. J., 1984,"Rubber-Modified Epoxies:morphology, transitions and mechanical properties, "ACS advance in Chemistry Series, Vol. 208, pp. 261-279.
5. King, N. E. and Andrews, E. H., 1978, "Fracture Energy of Epoxy resins above Tg", J. Mater. Sci., Vol. 13, pp. 1291-1302.
6. Kinloch, A. J., 1990, "Adhesive Bonding: The Importance of Polymer Interfaces, "Chima Vol. 44, pp. 318-321.
7. Lloyd, T. B., 1994, "Experimental procedures to characterize acid-base and dispersion force contributions to solid wettability - A Review," Colloid and Surfaces A: Physicochemical and Engineering Aspects, " Vol. 93, pp. 25-37.
8. Pearson, R. A., Lloyd, T. B., Azimi, H. R., Hsiung, J.-C., Early, M. S., and Brandenburger, P. D.,"Adhesion Issues in Epoxy-Based Chip Attach Adhesives," IEEE-CMPT 20 (1997) 31-37.
9. Tay, A.A. O., Tan, G. L. and Lim, T.B., 1994, "Predicting Delamination in Plastic IC Packages and Determining Suitable Mold Compound Properties", IEEE-CMPT, Vol. 17, pp. 201-208.