Emerging challenges of underfill for flip chip application

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 175-179

  Chen, Tim ^a   Wang, Jinlin ^a   Lu, Daoqiang ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT ANGLE; DIES; ELECTRIC POWER UTILIZATION; ELECTRONICS PACKAGING; FILLERS; FRACTURE TOUGHNESS; LEAD ALLOYS; PASSIVATION; SILICON; SOLDERING ALLOYS; SURFACE TENSION;

BUMP PITCH; LEAD-FREE SOLDERS; NANO-PARTICLE FILLERS;

FLIP CHIP DEVICES;

EID: 10444268074     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)

1. Wen-Bin Young and Wen-Lin Yang, "Underfill Viscous Flow between Parallel Plates and Solder Bumps", IEEE Trans. Comp. Packag. Technol., Vol. 25, No. 4, pp. 695-700, Dec., 2002.
2. S. Hanand K. K. Wang, "Analysis of the Flow Encapsulant during Underfill Encapsulation of Flip Chip", IEEE Trans. Comp., Packag., Manufact. Technol., B, Vol. 20, pp. 424-433, Nov., 1997.
3. Wen-Bin Young and Wen-Lin Yang, "The Effect of Solder Bump Pitch on the Underfill Flow", IEEE Trans. Advan. Packag., Vol. 25, No. 4, pp. 537-542, Dec., 2002.
4. Y.-L. Liu, C.-Y. Hsu, W.-L. Wei, R.-J. Jeng, "Preparation and Thermal Properties of Epoxy-Silica Nanocomposites from Nanoscale Colloidal Silica", Polymer, 44, pp 5159-5167, 2003
5. K. Gross, S. Hackett, W. Schultz, C. P. Wong, "Nanocomposites Underfills for Flip Chip Application" Proc. Electronic Components and Technology Conference, May 2003, pp 951-956
6. Jinlin Wang and Tim Chen, "The Effect of Flow Properties on Filler Settling of Underfill in Flip Chip Package", to be published in Proc. Electronic Components and Technology Conference, June 2004
7. C. P. Wong, Polymers for Electronics and Photonic Applications. Boston, MA: Academic, 1993
8. J. H. Lau, Chip on Board. New York: Van Nostrand Reinhold, 1994
9. D. Suryanarayana, R. Hsiao, T. P. Gall, and J. J. McCreary, "Enhancement of flip-chip fatigue life by encapsulation," IEEE Trans. Comp., Hybrids., Manufact. Technol., Vol. 14, pp. 218-223, 1991
10. J. M. Hurley and T. L. Berfield, "Underfill-induced stresses in flip chip assemblies", to be published in ECTC, June 2004
11. J. C. Suhling et. al., "Measurement of Backside Flip Chip Die Stresses Using Piezoresistive Test Die", Proc. IMAPS'99, Chicago, IL, Oct. 26-28, 1999
12. M. Todd, L. Crane, G. Carson, J. Zhang, "Development of low stress materials for low-K copper integrated circuit packaging", Proc. IMAPS Advanced Technology Workshop, San Diego, CA, May 2003
13. K. Nagarajan, K. Desai, M. Todd, G. Carson, "Flip chip underfill technology development for next generation silicon technologies", to be published in ECTC, June 2004
14. C. P. Wong, S. H. Shi, and G. Jefferson, "High Performance No-Flow Underfill for Low-cost Flip-Chip Application: Material Characterization", IEEE Trans. On Component, Packaging, and Manufacturing Technology, Part A. Vol. 21(3), 1998, p. 450
15. S. H. Shi, C. P. Wong, "Recent advances in the development of no-flow underfill encapsulants - a practical approach towards the actual manufacturing application", IEEE Transaction on Electronics Packaging Manufacturing, Vol. 22, 1999, pp. 331-339
16. nd Electronics Components and Technology Conf, San Diego, CA, May 2002, pp. 404-410.
17. M. Previti, "NO-flow underfill: a reliability and failure mode analysis", Proc. APEX, San Diego, CA, Jan. 2001, pp. MT2-1 1-5
18. C. Feger, N. C. LaBianca, H. K. Shobha, et.al. "A wafer level underfill process for flip chip packaging", Proc. IMAPS Topical Workshop and Exhibition on Flip Chip Packaging, Austin, TX, June 2003
19. R. W. Johnson, Q. Wang, F. Ding, Z. Hou, L. Crane et.al. "Flip Chip Assembly with Wafer Applied Underfill", Proc. IMAPS Topical Workshop and Exhibition on Flip Chip Packaging, Austin, TX, June 2003
20. A. Xiao, Q. Tong, G. Dutt, A Savoca, et.al. "Novel Materials for Wafer Level Flip Chip Packaging", Proc. IMAPS Topical Workshop and Exhibition on Flip Chip Packaging, Austin, TX, June 2003