Adhesion and reliability of polymer/inorganic interfaces in microelectronic applications

American Society of Mechanical Engineers, Applied Mechanics Division, AMD

Volumn 222, Issue , 1997, Pages 33-39

  Snodgrass, J M ^a   Kook, S Y ^a   Kirtikar, A ^a   Dauskardt, R H ^a  

^a Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); FATIGUE TESTING; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); MICROELECTRONICS; MICROSTRUCTURE; MORPHOLOGY; POLYMERS; RELIABILITY; SILICON;

CYCLIC FATIGUE LOAD; DEBONDING; INTERFACIAL FRACTURE RESISTANCE;

FRACTURE MECHANICS;

EID: 0031345305     PISSN: 01608835     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

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