Coffin-manson based fatigue analysis of underfilled DCA

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1655-1661

  Gektin, Vadim ^a   Bar Cohen, Avram ^a   Witzman, Sorin ^a  

^a University of Minnesota   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0008603689     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (22)

1. Chen, A. S., Schaefer, W. J., Lo, R. H. Y., and Weiler, P., 1994, "A Study of the Interactions of Molding Compound and Die Attach Adhesive, with regards to Package Cracking," Proc. Proc. of 44th Electronic Components and Technology Conference, pp. 115-120.
2. Chen, W. T., and Nelson, C. W., 1979, "Thermal Stress in Bonded Joints," IBM Journal of Research and Development, Vol. 23, pp. 179-188.
3. Chien, I. Y., and Nguyen, M. N., 1994, "Low Stress Polymer Die Attach Adhesive for Plastic Packages," Proc. Proc. of 44th Electronic Components and Technology Conference, pp. 580-586.
4. Clementi, J., McCreary, J., Niu, T. M., Palomaki, J., and Varcoe, J., 1993, "Flip-Chip Encapsulation on Ceramic Substrates," Proc. Proc. of 43rd Electronic Components and Technology Conference, pp. 175-181.
5. Engelmaier, W., 1983, "Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 3, pp. 232-237.
6. Engelmann, B., and Hallquist, J. O., 1991, NIKE2D A Nonlinear, Implicit, Two-Dimensional Finite Element Code for Solid Mechanics LLNL.
7. Ficke, J., Gravrok, R., Hokanson, K., and Berry, C., 1996, "High-Bandwidth Low-Latency 3D Memory Module," Proc. Proc. of 1996 International Conference on Multichip Modules, pp. 1-6.
8. Gektin, V., and Bar-Cohen, A., 1996, "Mechanistic Figures of Merit for Die-Attach Materials," Proc. Proc. of 5th Intersociety Conference on Thermal and Thermo Mechanical Phenomena in Electronic Systems, pp. 306-313.
9. Gektin, V., Bar-Cohen, A., and Witzman, S., 1996, "Thermo-Structural Behavior of Underfilled Flip-Chips," Proc. Proc. of 46th Electronic Components and Technology Conference, pp. 440-447.
10. Goland, B. M., and Reissner, E., 1944, "The Stresses in Cemented Joints," Journal of Applied Mechanics, Vol., pp. 17-27.
11. Hong, B. Z., and Burrell, L. G., 1995, "Nonlinear Finite Element Simulation of Thermoviscoplastic Deformation of C4 Solder Joints in High Density Packaging Under Thermal Cycling," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 18, pp. 1-7.
12. Hu, J. M., and Pecht, M., 1993, "Design of Reliable Die Attach," The International Journal of Microcircuits and Electronic Packaging, Vol. 16, pp. 1-21.
13. Jeannotte, D. A., Goldmann, L. S., and Howard, R. T., 1989, In Tummala, R. R., and Rymaszewski, E. J., editors, Microelectronics Packaging Handbook, pp. 225-359. Van Nostrand Reinold.
14. Ju, T.-H., Lin, W., Lee, Y. C., and Liu, J. J., 1994, "Effects of Ceramic Ball-Grid-Array Package's Manufacturing Variations on Solder Joint Reliability," Proc. Proc. of 3rd International Conference on Multichip Modules, Vol. 2256, pp. 514-519.
15. Lee, L., and Mirman, B. A., 1990, "Bending Stiffness of a Multilayer Structure," Proc. Proc. of International Electronics Packaging Conference, pp. 150-164.
16. Ling, S., and Dasgupta, A., 1996, "A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints," Journal of Electronic Packaging, Vol. 118, pp. 72-79.
17. Mirman, B. A., 1992, "Microelectronics and the Built-up-Bar Theory," Journal of Electronic Packaging, Vol. 114, pp. 384-388.
18. O'Malley, G., Giesler, J., and Machuga, S., 1994, "The Importance of Material Selection for Rip Chip on Board Assembly," Proc. Proc. of 44th Electronic Components and Technology Conference, pp. 387-394.
19. Powell, D. O., and Trivedi, A. K., 1993, "Flip-Chip on FR - 4 Integrated Circuit Packaging," Proc. Proc. of 43rd Electronic Components and Technology Conference, pp. 182-186.
20. Suhir, E., 1989, "Thermally Induced Interfacial Stresses in Elongated Bimaterial Plates," Applied Mechanics Review, Vol. 42, pp. s253-s262.
21. Wang, D. W., and Papathomas, K. I., 1993, "Encapsulant for Fatigue Life Enhancement of Controlled Collapse Chip Connection (C4)," Proc. Proc. of 43rd Electronic Components and Technology Conference, pp. 780-784.
22. Witzman, S., 1995, Private Communications Northern Telecom.