Materials and mechanics issues in flip-chip organic packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 524-534

  Wu, T Y ^a   Tsukada, Y ^a   Chen, W T ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; ENCAPSULATION; INTEGRATED CIRCUIT MANUFACTURE; INTERFACES (MATERIALS); RELIABILITY; SEMICONDUCTING SILICON; SOLDERED JOINTS; THERMAL EXPANSION;

FLIP CHIP ORGANIC PACKAGING; MODULE CARD ASSEMBLY; SOLDER BUMP CHIP INTERCONNECTION; SURFACE LAMINAR CIRCUIT;

FLIP CHIP DEVICES;

EID: 0029698873     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (40)