Estimate the thermomechanical fatigue life of two chip scale packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 797-802

  Yao, Qizhou ^a   Qu, Jianmin ^a   Wu, Sean X ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FATIGUE OF MATERIALS; FATIGUE TESTING; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; MECHANICAL PROPERTIES; NUMERICAL METHODS; SOLDERED JOINTS; THERMAL LOAD; THERMOMECHANICAL TREATMENT;

COFFIN-MANSON EQUATIONS; TEMPERATURE CYCLING; TWO CHIP SCALE PACKAGES;

ELECTRONICS PACKAGING;

EID: 0032641905     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)