Reliability investigations of FCOB assemblies with process-induced defects

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 50-57

  Schubert, A ^a   Dudek, R ^a   Kloeser, J ^a   Michel, B ^a   Reichl, H ^a   Hauck, T ^a   Kaskoun, K ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL DEFECTS; DELAMINATION; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FINITE ELEMENT METHOD; SEMICONDUCTOR DEVICE MODELS; THERMAL CYCLING;

SOLDER BUMPS; UNDERFILL MATERIALS;

FLIP CHIP DEVICES;

EID: 0033701715     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)