Investigation of underfill adhesion in plastic flip-chip packages

American Society of Mechanical Engineers, Applied Mechanics Division, AMD

Volumn 222, Issue , 1997, Pages 115-118

  Dai, Xiang ^a   Brillhart, Mark V ^b   Ho, Paul S ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

^b HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CRACKS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); PRINTED CIRCUIT BOARDS; SUBSTRATES;

DOUBLE CANTILEVER BEAM; PLASTIC FLIP CHIP PACKAGING; UNDERFILL;

FRACTURE MECHANICS;

EID: 3643084546     PISSN: 01608835     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)

1. Huchinson, J.W., and Suo, Z.,"Mixed Mode Cracking in Layered Materials," Adv. Appl. Mech., 29, 63-191, 1992.
2. Kinloch, A. J., Fracture Mechanics of Adhesive Joints," Adhesion and Adhesives: SCIENCE AND TECHNOLOGY, Chapter 7,CHAPMAN & HALL, London, 1990.
3. Hashemi, S., Kinloch, A. J, and Williams, J. G., "The analysis of interlaminar fracture in uniaxial fiber-polymer composites", Proc. R. Soc. Lond., A 427, 173-199, 1990.
4. Blackman, B.R.K., Dear, J. P., Kinloch, A. J, Macgillivaray, H., Wang, Y., Williams, J. G., and Yayla, P., "The failure of fiber composites and adhesively bonded fiber composites under high rates of test. Part 1: Mode 1 loading - experimental studies", Journal of Materials Science, 30, 5885-5900, 1995.
5. Brillhart, M. V., and Dai, S., HP EADC internal report, 1997.