Underfill selection strategy for Pb-free, low-k and fine pitch organic flip chip applications

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1595-1603

  Paquet, Marie Claude ^a   Gaynes, Michael ^a   Duchesne, Eric ^a   Questad, David ^a   Bélanger, Luc ^a   Sylvestre, Julien ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC LAYERS; FINE PITCH ORGANIC FLIP CHIP APPLICATIONS; UNDERFILL SELECTION STRATEGY;

DIELECTRIC MATERIALS; HARDWARE; INDUSTRIAL APPLICATIONS; LEAD; RELIABILITY; SOLDERED JOINTS;

FLIP CHIP DEVICES;

EID: 33845564550     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645870     Document Type: Conference Paper

References (10)

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3. th Annual Adhesion Society Meeting, Jacksonville, FL, Feb. 2006.
4. Private discussion with D. Henderson, IBM Corp., 1/2006.
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10. Gruber, P. A. et al, "Low-Cost Wafer Bumping," IBM Journal of Research and Development, Vol. 49, No. 4/5, 2005, pp. 621-638.