Adhesion issues in flip-chip on organic modules

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 263-268

  Tran, S K ^a   Questad, D L ^a   Sammakia, B G ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ENCAPSULATION; FLIP CHIP DEVICES; INTERFACES (MATERIALS); LAMINATES; ORGANIC COMPOUNDS; RELIABILITY; SEMICONDUCTING SILICON; SOLDERED JOINTS; STRESS ANALYSIS; SURFACE TREATMENT; THERMAL CYCLING;

CURE KINETICS; HIGHLY ACCELERATED STRESS TESTING; ORGANIC LAMINATE; SOLDERMASK INTERFACE; VOID FORMATION;

ELECTRONICS PACKAGING;

EID: 0031642325     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)