Enhancement of underfill encapsulants for flip-chip technology

Soldering and Surface Mount Technology

Volumn 11, Issue 3, 1999, Pages 33-39

  Vincent, M B ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ELASTIC MODULI; ENCAPSULATION; FLIP CHIP DEVICES; PASSIVATION; RHEOLOGY; SILICON NITRIDE; STRENGTH OF MATERIALS;

UNDERFILL ENCAPSULANTS;

SURFACE MOUNT TECHNOLOGY;

EID: 0033284440     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540919910293856     Document Type: Article

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