150-μm pitch Cu/Low-k flip chip packaging with polymer encapsulated dicing line (PEDL) and Cu column interconnects

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 1, 2008, Pages 58-65

  Yoon, Seung Wook ^a   Thew, Serene Meei Ling ^a   Lim, Samuel Yak Long ^a   Hnin, Wai Yin ^a   Chai, Tai Chong ^a   Viswanath, Akella G K ^b   Kripesh, Vaidyanathan ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

Author keywords

CU post; CU low k packaging; Flip chip packaging; High lead solder; Solder joint reliability

Indexed keywords

DIELECTRIC MATERIALS; ENCAPSULATION; FAILURE ANALYSIS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; PHOTORESISTS; POLYMERS; SHEAR STRESS; WSI CIRCUITS;

METAL REDISTRIBUTION; POLYMER ENCAPSULATED DICING LINE;

CHIP SCALE PACKAGES;

EID: 40549120988     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.916296     Document Type: Article

References (5)

1. L. L. Mercado, C. Goldberg, S.-M. Kuo, T.-Y. Lee, and S. K. Pozder, "Analysis of flipchip packaging challenges on copper/low-k interconnectes," IEEE Trans. Device Mater. Rel., vol. 3, no. 4, pp. 111-118, Dec. 2003.
2. S. W. Yoon, V. Kripesh, W. W. Kwan, L. C. Yong, C. X. Tong, G. Dong, I. J. Rasiah, and M. K. Iyer, "UBM integrity studies on copper/low-k dielectrics for fine pitch flip chip packaging," presented at the 53rd Electronic Compon. Technol. Conf., New Orleans, LA, 2003.
3. S. W. Yoon, V. Kripesh, L. Hongyu, L. C. Yong, S. Y. J. Jeffrey, and M. K. Iyer, "Flipchip bump integrity with copper/ultra low-k dielectrics for fine pitch flipchip packaging," presented at the 54th Electronic Compon. Technol. Conf., Las Vegas, NV, 2004.
4. U. Vissa, N. Butel, J. Rowatt, and C. Thielen, "A systematic approach to qualification of 90 nm low-K flip-chip packaging," presented at the 56th Electronic Compon. Technol. Conf., San Diego, CA, 2004.
5. S. H. Fan et al., "Effect of cooling rate on the isothermal fatigue behavior of CBGA solder joints in shear," IEEE Trans. Adv. Packag., vol. 24, no. 1, pp. 10-16, Feb. 2001.