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Volumn , Issue , 2000, Pages 1405-1409
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The current status of lead-free solder alloys
a
a
AIM
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
BINARY ALLOYS;
ELASTIC MODULI;
ELECTRONICS INDUSTRY;
ELECTRONICS PACKAGING;
LAWS AND LEGISLATION;
LEAD;
PRINTED CIRCUIT BOARDS;
SOLDERING ALLOYS;
TENSILE STRENGTH;
THERMAL CYCLING;
TIN ALLOYS;
YIELD STRESS;
ELECTRONICS ASSEMBLY;
LEAD FREE ALLOYS;
LEAD FREE SOLDERING;
SOLDERING;
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EID: 0034482148
PISSN: 05695503
EISSN: None
Source Type: Journal
DOI: 10.1109/6104.980031 Document Type: Article |
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Times cited : (32)
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References (0)
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