Magnetically aligned anisotropic conductive adhesive for microwave applications

IEEE Transactions on Microwave Theory and Techniques

Volumn 56, Issue 12, 2008, Pages 2942-2949

  Moon, Sungwook ^a   Sigmarsson, Hjalti H ^a   Huang, Yilei ^a   Bruemmer, Tim ^b   Khanna, S Kummar ^b   Chappell, William J ^a  

^a PURDUE UNIVERSITY   (United States)

^b Nexaura Systems LLC   (United States)

Author keywords

Anisotropic media; Conductive particles; Coplanar waveguides; Flip chip bonding; High frequency; Interconnects; Packaging

Indexed keywords

ADHESION; ADHESIVE JOINTS; ANISOTROPY; BRAZING; CHIP SCALE PACKAGES; COPLANAR WAVEGUIDES; ELECTRONIC EQUIPMENT MANUFACTURE; FLIP CHIP DEVICES; MATERIALS PROPERTIES; MICROWAVES; WAVEGUIDES; WELDING;

ANISOTROPIC MEDIA; CONDUCTIVE PARTICLES; FLIP-CHIP BONDING; HIGH FREQUENCY; INTERCONNECTS;

ELECTRONICS PACKAGING;

EID: 57949096855     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2008.2007309     Document Type: Conference Paper

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