Flip chip on board mounting processes using anisotropic conductive adhesives and eutectic solder

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 76-82

  Zhong, Zhaowei ^a   Wong, Stephen ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANISOTROPY; CONDUCTIVE FILMS; ENCAPSULATION; EUTECTICS; FLIP CHIP DEVICES; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERING;

ANISOTROPIC CONDUCTIVE ADHESIVES; EUTECTIC SOLDER BUMPS; FLIP CHIP ON BOARD (FCOB);

ELECTRONICS PACKAGING;

EID: 0032230856     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)