RF and mechanical characterization of flip-chip interconnects in CPW circuits with underfill

IEEE Transactions on Microwave Theory and Techniques

Volumn 46, Issue 12 PART 2, 1998, Pages 2269-2275

  Feng, Zhiping ^a   Zhang, Wenge ^a   Su, Bingzhi ^a   Gupta, K C ^a   Lee, Y C ^a  

^a UNIVERSITY OF COLORADO   (United States)

Author keywords

CPW circuits; Flip chip; Mechanical characterization; RF characterization

Indexed keywords

ALUMINA; COMPUTATIONAL METHODS; ELECTROMAGNETIC WAVE SCATTERING; FLIP CHIP DEVICES; MATHEMATICAL MODELS; MICROWAVES; MILLIMETER WAVES; SEMICONDUCTING GALLIUM ARSENIDE; WAVEGUIDES;

FLIP CHIP INTERCONNECTS;

INTERCONNECTION NETWORKS;

EID: 0032299491     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.739210     Document Type: Article

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