Magnetically aligned anisotropic conductive adhesive for high-frequency interconnects

IEEE MTT-S International Microwave Symposium Digest

Volumn 2005, Issue , 2005, Pages 861-864

  Huang, Yilei ^a   Gong, Xun ^a   Bruemmer, Tim ^b   Khanna, S Kumar ^b   Chappell, William J ^a  

^a Purdue University   (United States)

^b Nexaura Systems LLC   (United States)

Author keywords

Anisotropic conductive adhesive; Bonding; High density interconnects; Multilayer circuits

Indexed keywords

ANISOTROPIC CONDUCTIVE ADHESIVE (ACA); CONDUCTIVE PATHS; HIGH DENSITY INTERCONNECTS; MULTILAYER CIRCUITS;

ELECTRIC CONDUCTIVITY; EPOXY RESINS; MAGNETIC FIELDS; NATURAL FREQUENCIES; SOLDERING;

OPTICAL INTERCONNECTS;

EID: 33749267662     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2005.1516754     Document Type: Conference Paper

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