High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 3, 2000, Pages 542-545

  Ryu, Woonghwan ^b,c   Yim, Myung Jin ^b   Ahn, Seungyoung ^b   Lee, Junho ^b   Kim, Woopoung ^d   Paik, Kyung Wook ^a,b   Kim, Joungho ^a,b  

^a IEEE   (United States)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^c SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^d GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPIC CONDUCTIVE FILM (ACF) FLIP CHIP INTERCONNECTIONS; SOFTWARE PACKAGE SPICE;

ANISOTROPY; COMPUTER SIMULATION; COMPUTER SOFTWARE; CONDUCTIVE FILMS; ELECTRONICS PACKAGING; EQUIVALENT CIRCUITS; GENETIC ALGORITHMS; INTERCONNECTION NETWORKS; MAGNETIC PERMEABILITY; MATHEMATICAL MODELS; OPTIMIZATION;

FLIP CHIP DEVICES;

EID: 0034273631     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.868855     Document Type: Article

References (4)

1. R. Sihlbom, M. Dernevik, Z. Lai, J. Piotr Starski, and J. Liu, "Conductive adhesives for high-frequency applications," IEEE Trans. Comp., Packag,. Manufact. Technol. A. vol. 21, pp. 469-477, Sept. 1998.
2. M.-J. Yim, W. Ryu, Y.-D. Jeon, J. Lee, S. Ahn, J. Kim, and K.-W. Paik, "Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications," IEEE Trans. Comp. Packag. Technol., vol. 22, pp. 575-581, Dec. 1999.
3. P. L. Werner, R. Mittra, and D. H. Werner, "Extraction of equivalent circuits for microstrip components and discontinuities using the genetic algorithm," IEEE Microwave Guided Wave Lett., vol. 8, pp. 333-335, Oct. 1998.
4. W. Ryu, S. Baik, H. Kim, J. Kim, M. Sung, and J. Kim, "Embedded microstrip structures for giga-hertz digital interconnection lines," IEEE Trans. Adv. Packag., vol. 23, pp. 495-503, Aug. 2000.