Low-cost flip-chip alternatives for millimeter wave applications

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 2002, Pages 2205-2208

  Heyen, Johann ^a   Schroeder, Jens ^b   Jacob, Arne F ^a  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

^b EUROSPACE Tech Entwicklungen GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BROADBAND AMPLIFIERS; ELECTRIC CONDUCTIVITY; FLIP CHIP DEVICES; PHOTORESISTS; SCATTERING PARAMETERS; WAVEGUIDES;

FLIP CHIPPED TEST SYSTEMS; MILLIMETER WAVE FREQUENCY;

MILLIMETER WAVE DEVICES;

EID: 0036063983     PISSN: 0149645X     EISSN: None     Source Type: Journal    
DOI: 10.1109/MWSYM.2002.1012310     Document Type: Article

References (10)

1. Millimeter-wave characteristics of flip-chip interconnects for multi chip modules
2. 76 GHz flip-chip MMICs for automotive radar
3. A flip-chip MMIC design with coplanar waveguide transmission line in the W-band
4. Flip chip interconnect analysis at millimetre wave frequencies
5. The flip-chip bump interconnection for millimeter-wave GaAs MMIC
6. Finite-difference time-domain analysis of flip-chip interconnects with staggered bumps
7. An accurate equivalent circuit model of flip chip and via interconnects
8. Flip chip technologies
9. SU-8 resists
10. Metal powder