Experimental analysis of mechanical and electrical characteristics of metal-coated conductive spheres for anisotropic conductive adhesives (ACAs) interconnection

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 3, 2006, Pages 528-534

  Kwon, Woon Seong ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Anisotropic conductive adhesive (ACA); Conductive particles; Contact resistance; Flip chip bonding; Load deformation characteristics

Indexed keywords

ADHESIVES; ANISOTROPY; BONDING; COATED MATERIALS; DEFORMATION; ELECTRIC PROPERTIES; MATHEMATICAL MODELS; MECHANICAL PROPERTIES;

ANISOTROPIC CONDUCTIVE ADHESIVE (ACA); CONDUCTIVE PARTICLES; CONTACT RESISTANCE; FLIP CHIP BONDING; LOAD-DEFORMATION CHARACTERISTICS;

CONDUCTIVE MATERIALS;

EID: 33748619528     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.880513     Document Type: Article

References (7)

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