Microwave model of anisotropie conductive film flip-chip interconnections for high frequency applications

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 4, 1999, Pages 575-581

  Yim, Myung Jin ^a   Ryu, Woonghwan ^a   Jeon, Young Doo ^a   Lee, Junho ^a   Ahn, Seungyoung ^a   Kim, Joungho ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Anistropic conductive film; Flip chip; Microwave model; Ni au bump; Resonance frequency

Indexed keywords

ANISOTROPY; CONDUCTIVE FILMS; ELECTRIC NETWORK ANALYSIS; ELECTROLESS PLATING; FLIP CHIP DEVICES; GOLD PLATING; INTEGRATED CIRCUIT TESTING; MATHEMATICAL MODELS; MICROWAVE INTEGRATED CIRCUITS; NICKEL PLATING; POLYCRYSTALLINE MATERIALS; SEMICONDUCTING SILICON;

ANISOTROPICALLY CONDUCTIVE FILM (ACF) FLIP CHIP INTERCONNECTIONS; INPUT/OUTPUT (I/O) PADS;

INTERCONNECTION NETWORKS;

EID: 0033343060     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.814974     Document Type: Article

References (7)

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