Anisotropic conductive adhesives for millimeter-wave flipchip interconnections

Conference Proceedings- European Microwave Conference

Volumn 1, Issue , 2004, Pages 85-88

  Heyen, Johann ^a,b   Jacob, Arne F ^a  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

^b EPCOS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANISOTROPY; GOLD; INTERCONNECTION NETWORKS; MILLIMETER WAVES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

CONDUCTIVE ADHESIVES; FLIPCHIP INTERCONNECTIONS; MULTICHIP MODULES (MCM); THERMOCOMPRESSION;

FLIP CHIP DEVICES;

EID: 18744383079     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. J. Heyen, T. v. Kerssenbrock, A. Chernyakov, P. Heide, A. F. Jacob, "Novel LTCC-/BGA-Modules for Highly Integrated Millimeter-Wave Transceivers", IEEE Trans. Microwave Theory Tech., vol. 51, no. 12, Dec. 2003, pp. 2589-2596.
2. J. Heyen, A. Gordiyenko, P. Heide, A. F. Jacob, "Vertical Feedthroughs for Millimeter-Wave LTCC Modules", Proc. 33rd EuMC 2003, Munich, Oct. 2003, pp. 411-414.
3. J. H. Lau, Flip chip technologies, New York: Me Graw-Hill, 1996.
4. H. Kusamitsu, Y. Morishita, K. Maruhashi, M. Ito, K. Ohata, "The Flip-Chip Bump Interconnection for Millimeter-Wave GaAs MMIC," IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 1, pp. 23-28, January 1999.
5. W. Heinrich, A. Jentzsch, G. Baumann, "Millimeter-Wave Characteristics of Flip-Chip Interconnects for Multi Chip Modules," IEEE Trans. Microwave Theory and Tech., vol. 46, no. 12, pp. 2264-2268, December 1998.
6. J. Heyen, J. Schroeder, A. F. Jacob, "Low-Cost FlipChip Alternatives for Millimeter Wave Applications," IEEE MTT-S International Microwave Symposium Digest, pp. 2205-2208, June 2002.
7. H. Kristiansen, J. Liu, "Overview of Conductive Adhesive Interconnection Technologies for LCD's," IEEE Transactions on Components, Packaging, and Manufacturing Technology -Part A., vol. 21, no. 2, pp. 208-214, June 1998.
8. M.-J. Yim, W. Ryu, Y.-D- Jeon, J. Lee, S. Ahn, J. Kim, K.-W- Paik, "Microwave Model of Anisotropic Conductive Film Flip-Chip Interconnections for High Frequency Applications," IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, no. 4, pp. 575-581, December 1999.