A ruthenium-based multimetal-contact RF MEMS switch with a corrugated diaphragm

Journal of Microelectromechanical Systems

Volumn 17, Issue 6, 2008, Pages 1447-1459

  Ke, Feixiang ^a   Miao, Jianmin ^a   Oberhammer, Joachim ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Contact metal; Contact resistance; Corrugated membrane; RF microelectromechanical system (MEMS) switch; Wafer level packaging

Indexed keywords

BANDPASS FILTERS; COMPOSITE MICROMECHANICS; CONTACT RESISTANCE; DIAPHRAGMS; ELECTRIC CONTACTS; ELECTRIC LINES; ELECTRIC NETWORK ANALYSIS; ELECTROMECHANICAL DEVICES; MECHATRONICS; MEMS; METALS; MICROELECTROMECHANICAL DEVICES; MICROMECHANICS; NITRIDES; PROCESS ENGINEERING; RELIABILITY; RELIABILITY ANALYSIS; RUTHENIUM; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SILICON WAFERS;

AVERAGE LIFETIMES; CONTACT METAL; CONTACT PRESSURES; CONTACT RELIABILITIES; CONTACT SEPARATIONS; CORRUGATED MEMBRANE; DC SIGNALS; GOLD CONTACTS; INDUCED STRESSES; LINE RESISTANCES; MEASUREMENT RESULTS; METAL CONTACTS; METAL SURFACES; METALLIZATION; MULTI METALS; PROCESS PARAMETER VARIATIONS; RF ISOLATIONS; RF MICROELECTROMECHANICAL SYSTEM (MEMS) SWITCH; RF MICROELECTROMECHANICAL SYSTEM SWITCHES; RF-MEMS; SIGNAL CURRENTS; THEORETICAL ANALYSES; TRANSMISSION LINES; WAFER-LEVEL PACKAGING;

CORRUGATED METAL;

EID: 57449114037     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2008.2004786     Document Type: Article

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