Active opening force and passive contact force electrostatic switches for soft metal contact materials

Journal of Microelectromechanical Systems

Volumn 15, Issue 5, 2006, Pages 1235-1242

  Oberhammer, Joachim ^a   Stemme, Göran ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Contact material; Curved electrode actuator; Microelectromechanical systems (MEMS) switch; Microswitch; RF MEMS

Indexed keywords

CURVED-ELECTRODE ACTUATOR; ELECTROSTATIC SWITCHES; MICROELECTROMECHANICAL SYSTEMS (MEMS) SWITCHES; MICROSWITCHES; SOFT METAL CONTACT MATERIALS;

ACTUATORS; COMPUTER SIMULATION; ELECTRODES; ELECTROSTATIC DEVICES; FORCE CONTROL; MICROELECTROMECHANICAL DEVICES;

ELECTRIC SWITCHES;

EID: 33750004656     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2006.882810     Document Type: Article

References (28)

1. H. F. Schlaak, "Potentials and limits of micro-electromechanical systems for relays and switches," in Proc. Int. Conf. Electrical Contacts, Zurich, Switzerland, Sep. 9-12, 2002, pp. 19-30.
2. D. Hyman and M. Mehregany, "Contact physics of gold microcontacts for MEMS switches," IEEE Trans. Compon. Packag. Technol., vol. 22, no. 3, pp. 357-364, Sep. 1999.
3. H. Hosaka, H. Kuwano, and K. Yanagiswa, "Electromagnetic microrelays: concepts and fundamentalcharacteristics," in Proc. IEEE Microelectromechanical Systems, Fort Lauderdale, FL, Feb. 7-10, 1993, pp. 12-17.
4. J. Schimkat, "Contact materials for microrelays," in Proc. IEEE Microelectromechanical Systems, Heidelberg, Germany, Jan. 1998, pp. 190-194.
5. E. J. J. Kruglick and K. S. J. Pister, "Lateral MEMS microcontact considerations," IEEE J. Microelectromech. Syst., vol. 8, no. 3, pp. 264-271, Sep. 1999.
6. S. M. Majumder et al., "Study of contacts in an electrostatically actuated microswitch," in Proc. IEEE Electrical Contacts, Arlington, VA, Oct. 26-28, 1998, pp. 127-132.
7. S. Majumder, N. McGruer, and G. Adams, "Adhesion and contact resistance in an electrostatic mems microswitch," in Proc. IEEE Microelectromechanical Systems 2005, Miami, FL, Jan. 2005, pp. 215-218.
8. W. Scherer, B. Bader, and F. Gehrlach, Untersuchung des elektrischen kontaktverhaltens mikromechanischer schaltelemente Hahn-Schickard-Gesellschaft, Institut für Feinwerk- und Zeitmeßtechnik, Germany, 2001, Tech. Rep. FV-NR 11387N.
9. J. Schimkat, "Contact measurement providing basic design data for microrelay actuators," Sensors Actuators A: Phys., vol. 73, no. 1-2, pp. 138-143, Mar. 1999.
10. G. M Rebeiz, RF MEMS Theory, Design and Technology, 1st ed. Hoboken, NJ: Wiley, 2003.
11. T. Smith, "The hydrophilic nature of a clean gold surface," J. Colloid Interface Sci., vol. 75, no. 1, pp. 51-55, May 1980.
12. R. Coutu, P. Kladitis, K. Leedy, and R. Crane, "Selecting metal alloy electric contact materials for MEMS switches," IOP J. Micromech. Microeng., vol. 14, pp. 1157-1164, Jun. 2004.
13. L. L. Mercado, S. -M. Koo, T. -Y. T. Lee, and L. Liu, "A mechanical approach to overcome RF MEMS switch stiction problem," in Proc. IEEE Electronic Components and Technology Conf. 2003, New Orleans, LA, May 27-30, 2003, pp. 377-384.
14. S. Majumder, J. Lampen, R. Morrison, and J. Maciel, "Mems switches," IEEE Instrum. Measure. Mag., vol. 6, no. 1, pp. 12-15, Mar. 2003.
15. N. McGruer, G. Adams, L. Chen, Z. Guo, and Y. Du, "Mechanical, thermal, and material influences on ohmic-contact-type mems switch operation," in Proc. IEEE Microelectromechanical Systems, Istanbul, Turkey, Jan. 22-26, 2006, pp. 230-233.
16. G. M. Rebeiz and J. B. Muldavin, "RF MEMS switches and switch circuits," IEEE Microwave Mag., vol. 2, no. 4, pp. 59-71, Dec. 2001.
17. R. Legtenberg, J. Gilbert, S. Senturia, and M. Elwenspoek, "Electrostatic curved electrode actuators," IEEE J. Microelectromech. Syst., vol. 6, no. 3, pp. 257-265, Sep. 1997.
18. C. C. Cabuz, E. I. Cabuz, T. R. Ohnstein, J. Neus, and R. Maboudian, "Factors enhancing the reliability of touch-mode electrostatic actuators," Sensors Actuators A: Phys., vol. 79, pp. 245-250, Feb. 2000.
19. E. Thielicke and E. Obermeier, "Microactuators and their Technologies," Elsevier Mechatron., vol. 10, no. 4-5, pp. 431-455, Jun.-Aug. 2000.
20. Y. Hirai, M. Shindo, and Y. Tanaka, "Study of large bending and low voltage drive electrostatic actuator with novel shaped cantilever and electrode," in Proc. Micromechatronics Human Science, Nagoya, Japan, Nov. 25-28, 1998, pp. 161-164.
21. J. Oberhammer, M. Tang, A. Q. Liu, and G. Stemme, "Mechanically tri-stable in-line single-pole-double-through all-metal switch," in Proc. IEEE Micro Electromechanical Systems, Istanbul, Turkey, Jan. 22-26, 2006, pp. 898-901.
22. J. Oberhammer, A. Liu, and G. Stemme, "Numerical algorithm for quasi-static nonlinear simulation of touch-mode actuators with complex geometries and pre-stressed materials," in Proc. IEEE Transducers, Seoul, Korea, Jun. 5-9, 2005, pp. 2119-2122.
23. S. Majumder, J. Lampen, R. Morrison, and J. Maciel, "A packaged, high-lifetime ohmic MEMS RE switch," in IEEE MTT-S Microwave Symp. Digest, Philadelphia, PA, Jun. 8-13, 2003, vol. 3, pp. 1935-1938.
24. D. Hyman, A. Schmitz, B. Warneke, T. Y. Hsu, Y. Lam, J. Brown, J. Schaffner, A. Walston, R. Y. Loo, G. L. Tangonan, M. Mehregany, and J. Lee, "Surface micromachined RF MEMS switches on GaAs substrates," Int. J. RF Microw. Computer-Aided Eng., vol. 9, no. 4, pp. 348-361, Jul. 1999.
25. Y. Komura, M. Sakata, T. Seki, K. Kobayashi, K. Sano, S. Horiike, and K. Ozawa, "Micro machined relay for high frequency application," in Proc. 47th NARM Int. Relay Conf., Newport Beach, CA, Apr. 19-21, 1999.
26. I. Schiele and B. Hillerich, "Comparison of lateral and vertical switches for application as microrelays," IOP J. Micromech. Microeng., vol. 9, no. 2, pp. 146-150, Jun. 1999.
27. R. Blevins, Formulas for Natural Frequency and Mode Shape. Malabar, FL: Krieger, 1979.
28. W. C. Young and R. G. Budynas, Roark's Formulas for Stress and Strain. New York: McGraw-Hill, 2002.