Single-chip MEMS 5 × 5 and 20 × 20 double-pole single-throw switch arrays for automating telecommunication networks

Journal of Micromechanics and Microengineering

Volumn 18, Issue 1, 2008, Pages

  Braun, S ^a   Oberhammer, J ^a   Stemme, G ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATION; MEMS; MICROPROCESSOR CHIPS; NETWORK ROUTING; TELECOMMUNICATION NETWORKS; TELECOMMUNICATION SERVICES;

COPPER WIRE; DISTRIBUTION FRAMES; SINGLE CHIPS;

ANTENNA ARRAYS;

EID: 41849094441     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/1/015014     Document Type: Article

References (28)

1. Rebeiz G M and Muldavin R 2001 RF MEMS switches and switch circuits IEEE Microw. Mag. 2 59-71
2. Grant P D, Denhoff M W and Mansour R R 2004 A comparison between RF MEMS switches and semiconductor switches Proc. Int. Conf. on MEMS, NANO and Smart Systems (August 2004) pp 515-21
3. Rebeiz G M 2003 RF MEMS switches: status of the technology 12th Int. Conf. on TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems vol 2 pp 1726-9
4. Hunter D K 2000 Switching systems Encyclopedia Inform. Technol. 42 335-70
5. Turner J S and Melen R 2003 Multirate Clos networks IEEE Commun. Mag. 41 38-44
6. Kanai T, Umemura S, Inagaki S and Hosokawa S 1992 High density pin board matrix switches for automated MDF systems IEEE Trans. Compon. Packag. Manuf. Technol. 15 893-903
7. Inagaki S, Kanai T and Hosokawa S 1995 High-density pin-board matrix switch and its crosstalk characteristics Electron. Commun. Japan 78 42-52
8. Isobe H, Ito M and Murakami T 2001 Automatic MDF (main distribution frame) apparatus US Patent 6295483 (September 2001)
9. Hosaka H, Kuwano H and Murata K 1998 Development of miniature matrix relays for telecommunication systems Adv. Inform. Storage Syst. 10 275-85
10. McErlean E P, Hong J-S, Tan S G, Wang L, Cui Z, Greed R B and Voyce D C 2005 2 × 2 RF MEMS switch matrix IEEE Proc., Microw. Antennas Propag. 152 449-54
11. DiNardo S et al 2005 RF MEMS based switch matrices for complex switching networks Proc. Microwave Technology and Techniques Workshop, ESA ESTEC (May 2005)
12. Daneshmand M and Mansour R R 2006 Monolithic RF MEMS switch matrix integration Microwave Symposium Digest, IEEE MTT-S Int. pp 140-3
13. Yassini B, Choi S, Zybura A, Ming Yu, Mihailovich R E and DeNatale J F 2004 A novel MEMS LTCC switch matrix Microwave Symp. Digest, IEEE MTT-S Int. vol 2 pp 721-4
14. Tilmans H A C 2002 MEMS components for wireless communications (invited paper) Proc. EUROSENSORS XVI (September 2002) pp 1-34
15. Neukermans A and Ramaswami R 2001 MEMS technology for optical networking applications IEEE Commun. Mag. 39 62-9
16. Dobbelaere P, De Falta K, Gloeckner S and Patra S 2002 Digital MEMS for optical switching IEEE Commun. Mag. 40 88-95
17. Yang S, Peng H and Yuquan L 2005 The application and analysis of MEMS optical switches SPIE 6021 602135
18. Farinelli P et al 2004 RF-MEMS SPDT switch on silicon substrate for space applications 2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, Digest of Papers pp 151-4
19. Mansour R R 2005 RF MEMS for space applications 2005 Proc. Int. Conf. on MEMS, NANO and Smart Systems pp 191-2
20. Oberhammer J and Stemme G 2004 Low voltage high-isolation DC-to-RF MEMS switch based on an S-shaped film actuator IEEE Trans. Electron. Devices 51 149-55
21. Shikida M, Sato K and Harada T 1997 Fabrication of an S-shaped microactuator J. Microelectromech. Syst. 6 18-24
22. Bozler C, Drangmeister R, Duffy S, Gouker M, Knecht J, Kushner L, Parr R, Rabe S and Travis L 2000 MEMS microswitch arrays for reconfigurable distributed microwave components Microwave Symp. Digest, IEEE MTT-S Int. (June 2000) vol 1 pp 153-6
23. Cabuz C C, Cabuz E I, Ohnstein T R, Neus J and Maboudian R 2000 Factors enhancing the reliability of touch-mode electrostatic actuators Sensors Actuators A 79 245-50
24. Oberhammer J and Stemme G 2003 Incrementally etched electrical feedthroughs for wafer-level transfer of glass lid packages TRANSDUCERS'03: 12th Int. Conf. on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) vol 2 pp 1832-5
25. Niklaus F, Stemme G, Lu J Q and Gutmann R J 2006 Adhesive wafer bonding J. Appl. Phys. 99 031101
26. Oberhammer J, Niklaus F and Stemme G 2003 Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities Sensors Actuators A 105 297-304
27. Hyman D and Mehregany M 1999 Contact physics of gold microcontacts for MEMS switches IEEE Trans. Compon. Packag. Technol. 22 357-64
28. Oberhammer J and Stemme G 2006 Active opening force and passive contact force electrostatic switches for soft metal contact materials J. Microelectromech. Syst. 15 1235-42