Impact of lead-free soldering processes on the performance of signal relay contacts

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 1, 2004, Pages 30-41

  Johler, Werner ^a  

^a Tyco Electronics AXICOM   (Switzerland)

Author keywords

Contact performance; Lead free soldering; Reflow soldering; Signal relays; SMD; Telecom relays; Whisker

Indexed keywords

ELECTRIC CONTACTS; SOLDERING; SURFACE MOUNT TECHNOLOGY; THERMAL STRESS; TIN ALLOYS;

LEAD FREE SOLDERING PROCESSES; SIGNAL RELAY CONTACTS;

ELECTRONICS PACKAGING;

EID: 2442575767     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.825793     Document Type: Article

References (32)

1. R. J. K.R. J. Klein Wassink, Soldering in Electronics, 2nd ed. New York: Electrochemical Publications Ltd, 1989.
2. R. J. K.R. J. Klein Tukker et al., "Risks to health and the environment related to the use of lead in products," TNO Rep. STB-01-39, Delft, The Netherlands, Sept. 2001.
3. O. Deubzer, H. Griese, and T. Suga, "Lead-free soldering-future aspects of toxicity, energy and resource consumption," in Proc. EcoDesign'01: 2nd International Symposium on Environmentally Conscious Design and Inverse Manufacturing Symposium on, 2001, pp. 952-957.
4. A. Grusd, "Lead free solders in electronics," in Proc. SMI'97, 1997, pp. 648-661.
5. L. J. Tubini et al., "Examining the environmental impact of lead-free soldering alternatives," IEEE Trans. Electron. Packag. Manufact., vol. 24, pp. 4-9, Jan. 2001.
6. J. S. Hwang, "Overview of lead-free solders for electronics & microelectronics," in Proc. SMI'94, 1994, pp. 405-421.
7. United Nations, "Kyoto Protocol of the United Nations Framework Convention on Climatic Change," Rep. FCCC/CP/1997/L.7/add.1, United Nations, Dec. 1997.
8. H. Reichl and H. Griese, Eds., Proceedings Electronics Goes Green 2000+. Berlin, Germany: VDE Verlag, 2000, vol. 1.
9. IPC Roadmap, A Guide for Assembly of Lead-Free Electronics, June 2000.
10. Commission of the European Communities, Directive of the European Parliament and of the Council on End-of Life Vehicles (ELV), Brussels, Belgium, Sept. 2000.
11. ____, Directive of the European Parliament and of the Council on End-of Life Vehicles (ELV), Brussels, Belgium, June 2002.
12. ____, Directive of the European Parliament and of the Council on Waste Electrical and Electronic Equipment (WEEE), Brussels, Belgium, Nov. 2002.
13. ____, Directive of the European Parliament and of the Council on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (ROHS), Brussels, Belgium, Nov. 2002.
14. D. Suraski and K. Seelig, "The current status of lead-free solder alloys," IEEE Trans. Electron. Packag. Manufact., vol. 24, pp. 244-248, Oct. 2001.
15. G. Grossmann, "Lead-free soldering, state of the art," in Proc. Electronics Goes Green, vol. 1, 2000, pp. 61-66.
16. ____, "No fear for lead-free solder," in Proceedings 21st ICEC'02, 2002, pp. 303-309.
17. A. Z. Miric, "Lead-free soldering: legislation, projects, alternatives, outlook," in Proc. Electronics Goes Green, vol. 1, 2000, pp. 31-36.
18. W. Kruppa, Bleifrei Loeten in der Elektronikfertigung. Zurich, Switzerland: EKON Zurich, Oct. 2000.
19. A. Schubert et al., "Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders," in Proc. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2001, pp. 129-134.
20. G. Diespstraten, "Planung und Implementierung der Bleifreitechnik," EPP, Mar. 2001.
21. IEC, IEC 60 068-2-58 Ed.3(CDV): Environmental Testing - Part 2-58: Tests - Test Td - Test Methods for Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD), Geneva, Switzerland, 2002.
22. Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices, IPC/JEDEC J-STD-020B, July 2002.
23. U. Filor, "Loeten in der Damphase," EPP, May 2000.
24. VDC, The World of Electromechanical and Solid State Relays, 5th ed. Santa Clara, CA: Virtual Development Center, Santa Clara University, Oct. 1999.
25. W. Johler and W. Kälin, "The new generation telecom relays," in Proc. 46th International Relay Conference, 1998.
26. W. Johler, "Switching contacts for low level applications - an overview," in Proc. 21st ICEC 2002, Zurich, Switzerland.
27. R. D. Hilty, "Achieving lead free connector and processes," Int. Rep., Tyco Electronics, 2003.
28. W. Johler, "Precious metal-reduced contact materials in telecom- and signal relays," in Proc. 47th IEEE Holm Conference, 2001, pp. 104-116.
29. CECC61811-51-001 Detail Specification Electrosuisse, no. 3, p. 30, Mar. 2003.
30. IEC, IEC 60 068-2-54 (1985-01): Environmental Testing. Part 2: Tests. Test Ta: Soldering - Solderability Testing by the Wetting Balance Method, Geneva, Switzerland, 2003.
31. P. T. Vianco, I. Artaki, and A. M. Jones, "Reliability studies of surface mount boards manufactured with LEAD-free solders," in Proc. SMI'94, 1994, pp. 437-448.
32. K. G. Snowdon, C. G. Tanner, and J. R. Thompson, "Lead free soldering interconnect: current status and future developments," in Proc. 50th Electronic Components and Technology Conference, 2000, pp. 1416-1419.