Design and fabrication of silicon condenser microphone using corrugated diaphragm technique

Journal of Microelectromechanical Systems

Volumn 5, Issue 3, 1996, Pages 197-204

  Zou, Quanbo ^a   Li, Zhijian ^a,b,c   Liu, Litian ^a  

^a TSINGHUA UNIVERSITY   (China)

^b ST PETERSBURG STATE UNIVERSITY   (Russian Federation)

^c ACADEMIA SINICA   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING; FREQUENCY RESPONSE; MICROPHONES; MULTILAYERS; OPTIMIZATION; SEMICONDUCTING SILICON; STRESSES; THIN FILMS;

CORRUGATED DIAPHRAGM TECHNIQUE; MECHANICAL SENSITIVITY; SACRIFICIAL LAYER ETCHING; SILICON ANISOTROPIC ETCHING; SILICON CONDENSER MICROPHONE;

MICROELECTRONIC PROCESSING;

EID: 0030244813     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.536626     Document Type: Article

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