RF MEMS for ubiquitous wireless connectivity: Part 1 - Fabrication

IEEE Microwave Magazine

Volumn 5, Issue 4, 2004, Pages 36-49

  De Los Santos, Héctor J ^a   Fischer, Georg ^b   Tilmans, Harrie A C ^c   Van Beek, Joost T M ^d  

^a NanoMEMS Research LLC   (United States)

^b Lucent Bell Labs Europe   (Germany)

^c IMEC   (Belgium)

^d PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

HANDSETS; MICROWAVE SYSTEMS; PHOTOMASKS; WIRELESS CONDUCTIVITY;

CAPACITORS; ELECTRIC POWER UTILIZATION; METALLIC FILMS; MICROMACHINING; PHOTORESISTS; RELIABILITY; SILICA; SILICON WAFERS; STRENGTH OF MATERIALS; ULTRAVIOLET RADIATION; VARACTORS; WIRELESS TELECOMMUNICATION SYSTEMS;

MICROELECTROMECHANICAL DEVICES;

EID: 12344323331     PISSN: 15273342     EISSN: None     Source Type: Trade Journal    
DOI: 10.1109/MMW.2004.1380277     Document Type: Article

References (36)

1. H.J. De Los Santos, Introduction to Microelectromechanical (MEM) Microwave Systems. Norwood, MA: Artech House, 1999.
2. H.J. De Los Santos, "MEMS - A wireless vision," in Proc. Int. MEMS Workshop, Singapore, 2001, pp. 35-42.
3. H.J. De Los Santos, Introduction to Microelectromechanical (MEM) Microwave Systems, 2nd ed. Norwood, MA: Artech House, 2004.
4. T. Tsang, M. El-Gamal, S. Best, and H.J. De Los Santos, "Wide tuning range RF-MEMS varactors fabricated using the PolyMUMPs Foundry," Microw. J., pp. 22-44, Aug. 2003.
5. Th.G.S.M. Rijks, J.T.M. van Beek, P.G. Steeneken, M.J.E. Ulenaers, J. De Coster, and R. Puers, "RF MEMS tunable capacitors with large tuning ratio," in Proc. MEMS 2004 Dig, 2004, pp. 777-780.
6. H.A.C. Tilmans and S. Bouwstra, "Excitation and detection of silicon-based micromechanical resonators," Sens. Mater., vol. 9, pp. 521-540, Aug. 1997.
7. J.J. Yao, "Topical review: RF MEMS from a device perspective," J. Micromech. Microeng., vol. 10, no. 4, pp. R9-R38, Dec. 2000.
8. G.M. Rebeiz, RF-MEMS Theory, Design, and Technology. New York: Wiley, 2003.
9. S. Pamidighantam, R. Puers, K. Baert, and H.A.C. Tilmans, "Pullin voltage analysis of electrostatically actuated beam structures with fixed-fixed and fixed-free end conditions," J. Micromech. Microeng., vol. 12, pp. 458-464, 2002.
10. A.P. DeSilva, C. Vaughan, D. Frear, L. Liu, S.M. Kuo, J. Foerstner, J. Drye, J. Abrokwah, H. Hughes, C. Amrine, C. Butler, S. Markgraf, H. Denton, and S. Springer, "Motorola MEMS switch technology for high frequency applications," in Proc. MEMS Conf., Berkeley, CA, 2001, pp. 22-24.
11. T. Ikeda, Fundamentals of Piezoelectricity, New York: Oxford Univ. Press, 1989.
12. J.G. Smits and W. Choi, "The constituent equations of piezoelectric heterogenous bimorphs," IEEE Trans. Ultrason., Ferroelect. Freq. Contr., vol. 38, no. 3, pp. 256-270, 1991.
13. S.J. Gross, S. Tadigadapa, T.N. Jackson, S. Trolier-McKinstry, and Q.Q. Zhang, "Lead-zirconate-titanate-based piezoelectric micromachined switch," Appl. Physi. Lett., vol. 83, no. 1, pp. 174-176, July 2003.
14. J.Y. Park, Y.J. Yee, H.J. Nam, and J.U. Bu, "Micromachined RF MEMS tunable capacitors using piezoelectric actuators," in Proc. IEEE MTT-S, Phoenix, AZ, 2001, pp. 2111-2114.
15. G. Piazza, R. Abdolvand, G.K. Ho, and F. Ayazi, "Voltagetunable piezoelectrically-transduced single-crystal silicon micro-mechanical resonators," Sens. Actuators A, Phys., vol. 111, pp. 71-78, no. 1, 2004.
16. R.J. Wilfinger, P.H. Bardell, and D.S. Chhabra, "The resonistor: A frequency selective device utilizing the mechanical resonance of a silicon substrate," IBM J. Res. Develop., vol. 12, pp. 113-118, 1968.
17. T.S.J. Lammerink, M. Elwenspoek, R.H. van Ouwerkerk, S. Bouwstra, and J.H.J. Fluitman, "Performance of thermally excited resonators," Sens. Actuators, vol. A21-A23, no. 1-3, pp. 352-356, 1990.
18. D. Saias, P. Robert, S. Boret, C. Billard, G. Bouche, D. Belot, and P. Ancey, "An above IC MEMS RF switch," IEEE J. Solid-State Circuits, vol. 38, pp. 2318-2324, Dec. 2003.
19. H.A.C. Tilmans, E. Fullin, H. Had, M. Van de Peer, J. Kesters, E. Van Geffen, J. Bergqvist, M. Pantus, E. Beyne, K. Baert, and F. Naso, "A fully-packaged electromagnetic microrelay," in Proc. MEMS'99, Orlando, FL., pp. 25-30.
20. M. Ruan, J. Shen, and C.B. Wheeler, "Latching micromagnetic relays," J. MEMS, vol. 10, no. 4, pp. 511-517, 2001.
21. K. Najafi, "Micropackaging technologies for integrated microsystems: Applications to MEMS and MOEMS," Proc. SPIE, vol. 4979, pp. 1-19, 2003.
22. H. Guckel and D.W. Burns, "A technology for integrated transducers," in Proc. Transducers'85, Philadelphia, PA, pp. 90-92.
23. R. Legtenberg and H.A.C. Tilmans, "Electrostatically driven vacuum encapsulated polysilicon resonators, Part I: Design and fabrication," Sens. Actuators A, Phys., vol. 45, no. 1, pp. 57-66, 1994.
24. H. Stahl, A. Hoechst, F. Fischer, L. Metzger, R. Reichenbach, F. Laermer, S. Kronmueller, K. Breitschwerdt, R. Gunn, R. Watcham, C. Rusu, and A. Witvrouw, "Thin film encapsulation of acceleration sensors using polysilicon sacrificial layers," in Proc. Transducers'03, Boston, MA, pp. 1899-1902.
25. B.H. Stark and K. Najafi, "An ultra-thin hermetic package utilizing electroplated gold," in Proc. Transducers'01, Munich, Germany, pp. 194-197.
26. L. Lin, "MEMS post-packaging by localized heating," IEEE Trans. Adv. Pack., vol. 23, no. 4, pp. 608-616, 2000.
27. A. Jourdain, P. De Moor, S. Pamidighantam, and H.A.C. Tilmans, "Investigation of the hermeticity of BCB-sealed cavities for housing (RF-)MEMS devices," in Proc. MEMS 2002, Las Vegas, NV, pp. 677-680.
28. K. Gilleo and S. Corbett, "Getters-molecular scavengers for packaging," HDI, pp. 26-29, Jan. 2001.
29. H.A.C. Tilmans, H. Ziad, H. Jansen, O. Di Monaco, A. Jourdain, W. De Raedt, X. Rottenberg, E. De Backer, A. De Caussemaeker, and K. Baert, "Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab," in Proc. IEDM 2003, Washington, DC, pp. 921-924.
30. M. Fujii, I. Kimura, T. Satoh, and K. Imanaka, "RF MEMS switch with wafer level package utilizing frit glass bonding," in Proc. 32nd European Microwave Conf., Milan, Italy, 2002, vol. 1, pp. 279-281.
31. A. Margomenos, D. Peroulis, K.J. Herrick, and L.P.B. Katehi, "Silicon micromachined packages for RF MEMS switches," in Proc. 31st European Microwave Conf., London, UK, 2001, vol. 1, pp. 271-274.
32. A. Jourdain, S. Brebels, W. De Raedt, and H.A.C. Tilmans, "The influence of 0-level packaging on the performance of RF-MEMS devices," in Proc. 31st European Microwave Conf., London, UK, 2001, vol. 419, pp. 403-406.
33. H.A.C. Tilmans, "MEMS components for wireless communications," [CD-ROM] in Proc. EUROSENSORS XVI, Prague, Czech Republic, 2002, pp. 1-34.
34. A. Jourdain, X. Rottenberg, G. Carchon, and H.A.C. Tilmans, "Optimization of 0-level packaging for RF MEMS devices," in Proc. Transducers'03, Boston, MA, pp. 1915-1918.
35. A. Chandrasekhar, S. Brebels, S. Stoukatch, E. Beyne, W. De Raedt, and B. Nauwelaers, "The influence of packaging materials on RF performance," Microelectronics Reliability, vol. 43, no. 3, pp. 351-357, 2003.
36. M. Ito, K. Maruhashi, N. Senba, N. Takahashi, and K. Ohata, "Low cost multi-layer ceramic package for flip-chip MMIC up to W-band," in 2000 IEEE MTT-S Dig., 2000, pp. 57-60.