Design considerations in micromachined silicon microphones

Microelectronics Journal

Volumn 33, Issue 1-2, 2002, Pages 21-28

  Miao, Jianmin ^a   Lin, Rongming ^a   Chen, Longqing ^a   Zou, Quanbo ^a   Lim, Sin Yee ^a   Seah, Suan Hee ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Deep reactive ion etching; MEMS; Microphones; Polysilicon

Indexed keywords

DIAPHRAGMS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; POLYSILICON; REACTIVE ION ETCHING; SILICON WAFERS; SYSTEMS ANALYSIS;

CORRUGATED DIAPHRAGMS; SILICON MICROPHONES;

MICROPHONES;

EID: 0037005858     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(01)00100-8     Document Type: Article

References (13)

1. A review of silicon microphones
2. Fabrication of silicon condenser microphones using single wafer technology
3. Mechanical analysis of polycrystalline and single-crystalline silicon microstructures
4. Finite-element modeling and characterization of a silicon condenser microphone with a highly perforated backplate
5. Surface micromachining for microelectromechanical systems
6. Design and fabrication of silicon condenser microphone using corrugated diaphragm technique
7. Silicon capacitive microphones with corrugated diaphragms
8. A simple technique for the determination of mechanical strain in thin films with application to polysilicon
9. Fine-grained polysilicon films with built-in tensile strain
10. Dry silicon etching for MEMS