Novel structures in ceramic interconnect technology

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5231, Issue , 2003, Pages 223-228

  Peterson, Ken ^a   Rohde, Steven ^a   Turner, Tim ^a   Stokes, Robert ^a   Casias, Adrian ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

HTCC; IMS; Interconnect; LTCC; MEMS; Packaging; Window

Indexed keywords

ELECTRONICS PACKAGING; FIRING (OF MATERIALS); MICROELECTROMECHANICAL DEVICES; RAPID PROTOTYPING; SELF ASSEMBLY; SPECTROMETERS;

CERAMIC INTERCONNECT TECHNOLOGY; HIGH TEMPERATURE COFIRED CERAMIC; LOW TEMPERATURE COFIRED CERAMIC;

CERAMIC MATERIALS;

EID: 0041828722     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. S. Rohde and K. Peterson, Applying New LTCC/LIGA Construction Techniques in Realizing a Miniature Ion Mobility Spectrometer," IMAPS Advanced Technology Workshop on Packaging of MEMS and Related Micro Integrated Nano Systems, Denver, September 6-8, 2002.
2. Ken Peterson, Steve Garrett, and Cathy Reber, "Approaches to MEMS Packaging," IMAPS Advanced Technology Workshop on Packaging and Integration of MEMS & Related Microsystems, November 10-12, 2000, Orlando, Florida.
3. K. A. Peterson and R. D. Watson, "Microelectronic Device Package with an Integral Window", U.S. Patent 6,384,473, May 7, 2002.
4. K. A. Peterson and R. D. Watson, "Sealed Symmetric Multilayered Microelectronic Device Package with Integral Windows", U.S. Patent 6,489,670, December 3, 2002.
5. K. A. Peterson and R.D. Watson, "Bi-Level Multilayered Microelectronic Device Package with Integral Windows", U.S. Patent 6,495,895, December 17, 2002.
6. P. Wang, Y Liu and W. Kinzy Jones, "Thick Silver Tape in Low Temperature Cofire Ceramic (LTCC) for Thermal Management", Proceedings, 2001 International Microelectronics Conference, IMAPS, Baltimore, MD, 2001.
7. R. C. Cole, R. Robertson, J. Swenson, J.V. Osborn, "MEMS Packaging Technique using HF Vapor Release," Proceedings, International Conference on Advanced Packaging and Systems, Reno, Nevada, March 10-13, 2002.