Robust parylene-to-silicon mechanical anchoring

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2003, Pages 602-605

  Liger, Matthieu ^a   Rodger, Damien C ^b   Tai, Yu Chong ^a  

^a California Institute of Technology   (United States)

^b UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BIOCOMPATIBILITY; CHEMICAL VAPOR DEPOSITION; CONFORMATIONS; DELAMINATION; ELASTIC MODULI; FLUIDIC DEVICES; ORGANIC POLYMERS; PASSIVATION; REACTIVE ION ETCHING; SILICON; SUBSTRATES;

CHEMICAL BARRIER PROPERTIES; CONFORMAL DEPOSITION; FLEXIBILITY; MECHANICAL ANCHORING; PARYLENE;

MICROELECTROMECHANICAL DEVICES;

EID: 0038155499     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. T. Harder et al "Residual Stress in Parylene C" Proceedings of the 15th IEEE International Conference on Micro Electro Mechanical Systems (MEMS'02) pp. 435-438.
2. X. Q. Wang, Q. Lin, and Y.-C. Tai, "A Parylene Micro Check Valve," Proceedings of the 12th IEEE International Conference on Micro Electro Mechanical Systems, (MEMS '99) Florida, U.S.A. Jan. 17-21, 1999, pp. 177-182.
3. M. Liger, N. Pornisin-Sirirak, S. Ho, C.M. Ho and Y.C. Tai, "Large-Area Electrostatic-Valved Skins for Adaptive Flow Control on Ornithopter Wings". Solid State Sensor, Actuator, and Microsystems Workshop, Hilton Head Island South Carolina June 2-6 2002 pp. 247-250.
4. Qing He, Jun Xie (Caltech Micromachining Group), personal communication.
5. Product Specifications, A-174 Silane Promotion, Specialty Coating Systems, Inc., Indianapolis, IN, Phone: (800) 356-8260.