Metallization of Cu on parylene-C film micro-patterned by hot-embossing

6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings

Volumn , Issue , 2007, Pages 45-50

  Youn, Sung Won ^a   Ueno, Akihisa ^a   Takahashi, Masaharu ^a   Maeda, Ryutaro ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Adhesion; Copper; Electroplating; Hot embossing; Parylene C

Indexed keywords

ADHESIVES; CHEMICAL REACTIONS; ELECTRONICS INDUSTRY; ELECTROPLATING; INTEGRATED CIRCUITS; METALLIZING; MICROELECTRONICS; MONOMERS; NONMETALS; PHOTONICS; PHOTORESISTS; POLYMERS; SILICON; SILICON WAFERS; THICK FILMS; VAPOR DEPOSITION;

ADHESION; DIELECTRIC CONSTANTS; HOT-EMBOSSING; METALLIZATION; MICRO PATTERNING; PARYLENE FILM; PARYLENE-C; SIZE REDUCTIONS; VAPOR DEPOSITION POLYMERIZATION;

COPPER;

EID: 49949083830     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2007.4339135     Document Type: Conference Paper

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