Defect-free copper filling using nonisothermal electroless deposition with fluorocarbon surfactant

Journal of the Electrochemical Society

Volumn 155, Issue 12, 2008, Pages

  Chou, Yu Hsien ^a   Sung, Yuh ^b   Liu, Yih Ming ^a   Pu, Nen Wen ^a   Ger, Ming Der ^a  

^a NATIONAL DEFENSE UNIVERSITY   (Taiwan)

^b CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AMINES; AMMONIUM COMPOUNDS; COPPER PLATING; ELECTROLESS PLATING; INTEGRATED CIRCUITS; METALLIC FILMS; SURFACE ACTIVE AGENTS;

BOTTOM-UP; COMMERCIAL SURFACTANTS; COPPER DAMASCENES; COPPER FILMS; DRIVING FORCES; ELECTROLESS BATHS; ELECTROLESS COPPERS; ELECTROLESS DEPOSITIONS; FLUOROCARBON SURFACTANTS; IC INDUSTRIES; PATTERNED SUBSTRATES; QUATERNARY AMMONIUM IODIDES;

COPPER;

EID: 54949136993     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2999368     Document Type: Article

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